Event Details
- Exhibition
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This event has been completed
17th IC Packaging Technology Expo - January 13, 2016 - January 15, 2016
- Tokyo Big Sight
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Tokyo, Japan
- Introduction
- Advanced products/technologies/services will be showcased, necessary for downsizing and advance of semiconductors, LEDs, power devices, sensors and MEMS devices. Must-attend show for all technical persons involved in IC packaging.
- Participant
- Schedule
- Useful Links
- Reference link 1
- About Organiser
- Reed Exhibitions Japan Ltd.
- T: +81-3-3349-8519 F: +81-3-3349-8530
- E: inw@reedexpo.co.jp
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