Event Details
- Conference
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This event has been completed
IWLPC 2016 - International Wafer-Level Packaging Conference
- October 18, 2016 - October 20, 2016
- DoubleTree by Hilton San Jose
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San Jose, California, United States
- Introduction
- A highly regarded annual technical conference that covers leading edge advancements in the area of wafer-level technologies, the 2015 IWLPC conference was a great success with more than 650 attendees. Three themes were woven into the technical sessions: 1) fan-out WLCSP, 2) 2.5 and 3D IC packaging, and 3) MEMS packaging. The panel discussions and plenary presentations provided an effective backdrop to mingle and discuss these topics with a broad range of industry experts working in these areas. In particular, the targeted panel discussions chaired by Jan Vardaman on large-panel fan-out processing, and Francoise von Trapp on 2.5 and 3D technologies, provided a comprehensive perspective and highlighted how both processes are vying for next-generation advanced packaging applications.
Here are some of the conference and expo highlights:
650 attendees
65 exhibiting companies with 195 booth staff in attendance
16 countries represented
43 technical papers
- Useful Links
- Reference link 1
- About Organiser
- SMTA
- E: jenny@smta.org
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- Chip Scale Review